Contact Plating:
Controller Series:
Core Processor:
Count Rate:
Direction:
ECCN Code:
Factory Lead Time:
Height Seated (Max):
Interface:
JESD-609 Code:
Moisture Sensitivity Level (MSL):
Number of Bits per Element:
Number of I/O:
Number of Terminations:
Package Shape:
Part Status:
Pbfree Code:
Peak Reflow Temperature (Cel):
Power Supplies:
Program Memory Type:
Propagation Delay:
Published:
RAM Size:
Reach Compliance Code:
Supply Voltage:
Supply Voltage-Min (Vsup):
Surface Mount:
Temperature Grade:
Time@Peak Reflow Temperature-Max (s):
Voltage - Supply:
RFQ
BOM